Electronic component manufacturing is the main component of the electronic component industry and the foundation of the electronic information industry. Its technical level and production capacity directly affect the development of the entire industry.” Electronic paste is also called conductive paste as the basis for manufacturing electronic components. Materials, with-constant rheology and thixotropy, are basic functional materials that integrate materials, chemicals, and electronic technology; they have various aspects in resistance, sensitive devices, thick film integrated circuits, automobiles, daily necessities, etc. Application; especially with development of microelectronics technology, display technology and surface mounting technology, integration, intelligence, multi-function, precision, environmental protection, resulting in conductivity The slurry industry is developing at an unprecedented speed
At present, the demand for conductive paste in high-end products is still met by foreign imports. Therefore, the level of domestic electronic paste needs to be further improved, thereby improving the overall level of my country’s electronic industry in the world. At this stage, the application of electronic paste in my country is mainly represented by conductor paste, especially silver paste, aluminum silver paste, etc. However, the preparation of silver powder and the adjustment of silver paste are the key to the manufacture of silver conductive paste.
Silver powder or its compound as the conductive material of the conductive paste has the following advantages: (1) silver has good conductivity and its conductivity is the highest among all metals; (2)the price is the lowest, which has Conducive to cost reduction; (3) Silver can penetrate into the porcelain body surface when sintered at high temperature, so the silver layer has a strong adhesion to the ceramic surface, up to (35~75) x10′ g/cm2 or more; (4) Silver paste The reduction sintering temperature range is wide, ranging from 400 to 900 C; (5) The silver layer has good oxidation resistance and solderability. However, due to the easy migration of silver ions, the melting point of silver is not high enough,A study of adding palladium particles to high-temperature nano silver paste was conducted. The addition of has significantly delayed the migration of silver.