The nano-copper oxide can increase the internal bond strength, the static bending strength and the elastic modulus of the structural particle board, and the 24-hour absorption rate and the water absorption thickness expansion ratio are slightly lowered. In contrast, the basic copper carbonate reduces the internal bonding strength, and Increased water absorption for 24 hours, but the results were not significant;
The nanometer copper oxide reduces the reaction activation energy of the phenolic resin, and at the same time increases the reaction enthalpy, which promotes the curing reaction of the phenolic resin, and the curing degree thereof is improved;
The curing of phenolic resin adhesive has a good effect on the fixation of nano-copper oxide and basic copper carbonate in particleboard. It should be ensured that the copper content in the sample and the lost water before and after the loss of the same batch is determined to calculate the loss of preservative. rate.