With the rapid development of electronic technology, the production demand for various circuit boards has greatly increased. Copper is an important raw material for electroplating anodes, and the demand is greatly increased. Among them, PCB precision circuit boards need to use phosphor bronze balls as anodes. Phosphorus copper balls are suitable for electronic circuit boards, especially high-precision multi-layer circuit boards, which are essential components of electronic products. They rely heavily on high-quality PCB phosphor bronze ball anodes as the basic raw materials for manufacturing circuit boards. Therefore, the demand for phosphor bronze anode balls is considerable. This article mainly introduces the phosphor bronze ball of PCB. Firstly, it introduces why copper plating of copper is used in copper plating. Secondly, it explains the application of phosphor bronze ball in PCB and the global market forecast of phosphor bronze ball.
Why do PCB electroplating use Copper oxide ball?
Early copper plating with anaerobic copper anode, cathode copper or copper anode switch power ball as high as 100% or more than 100%, constitute a series of problems: irradiation content increasing, the additive consumption faster, anode mud of copper powder and increase, the anode power reduction, copper plating are prone to arts and crafts ball as burr and rough.Work on anodes by Neverse et al. 1954. Anode mixed with a small amount of phosphorus, found in the United States after a period of electrolysis process (black electrolytic anode films is very important for electroplating, advocate using electrolytic drag plate/false/wave plate is 2-3 ASD electrolytic copper ball current density of 4 to 10 hours, copper anode surface form black phosphate film, main ingredients for phosphating of copper Cu3P, this layer of black film with metal electrical conductivity, Some reverberation processes in copper anodic dissolution are changed, which is helpful to overcome the above shortcomings, and plays an important role in the quality and process stability of copper.
The dissolution of copper anode is mainly the formation of divalent copper ions. The experiment shows that the dissolution of copper in copper sulfate solution is carried out in two steps (rotating ring electrode and constant current method).
Cu-e-→Cu+ element response 1
Cu+–e-→Cu2+ elementary response 2
Cuprous ions also occur during the cathode stacking process:
Cu2++e-→Cu 3
Cu2++e-→Cu+ slow response 4
Cu++e-→Cu fast response 5