Below are silver-coated copper powder FAQ:

How many models does Yosoar could provide?

Yosoar, as a supplier of silver-coated copper powder’s dendritic, can provide silver content of 3%, 5%, 10 %, 15%, 20%, 25%, 30%, 35%, and other metals with different silver content. Silver copper powder. Dendritic product is a highly conductive filler material with excellent oxidation resistance. It can be widely used in industries such as conductive products, microelectronics technology, and material surface metallization treatment.

It is a newly developed conductive powder. It has excellent electrical conductivity and can replace some applications of silver powder. The dendritic has good oxidation resistance and dispersibility and can be used for medium and low-temperature paste.

What are the preparation methods of silver-coated copper powder?

The replacement method, chemical reduction method, replacement and chemical deposition composite method, and melting atomization method can all be used to prepare silver-coated copper powder. Different methods have different characteristics and advantages, and disadvantages, which also led them to have a different prospect.

What are the characteristics, advantages, and disadvantages of the product prepared by the fusion atomization method?

The melting atomization method for Silver Copper Alloy Powder is as follows: First, put the compound of silver powder and copper powder which are atomized into a molten liquid, and the segregation phenomenon is used to prepare silver-copper composite powder during the condensation process.

Second, prepared the ratio of silver of the silver-coated copper powder using this method. It can decreases from the outside surface of the copper powder to the inside. It has the advantages of good conductivity and can prevent migration and oxidation. The silver content is very small, but the preparation process is difficult. The cost is difficult to control and this way is not good for large-scale industrial production.

How is the electroless plating method to prepare silver-coated copper powder, and what are the advantages, and disadvantages?

The electroless plating method is also called electroless plating. During chemical electroplating, there is no need for external current, just by adding a matching reducing agent, so that the metal ions in the electroplating solution can be formed into metal and attached to the surface of the copper powder. Its advantages are simple operation, dense coating, wide application and low cost. The disadvantages mainly lie in the pollution problems caused by waste water discharge in the later stage. We also need to reprocess the waste water while producing on a large scale.

What are the advantages of electroless plating compared with electroplating?

First, electroless plating has a wide range of applications, which can be used on various substrates such as metals, semiconductors, and non-metals. Secondly, the process equipment required for electroless plating is relatively simple. The thickness of the substrate plating is all, and it can be controlled directly to make it have good chemical, mechanical, and magnetic properties. At present many advantages making it the most suitable preparation method for the product.

In the method of preparing silver-coated copper powder, what will be the result of using ammonia as a complexing agent when using alternative methods?

When ammonia water is used as the complexing agent, the copper powder has a longer silver plating time and has a low silver content, and its adsorption on the surface of the silver Copper Alloy Powder will hinder the progress of the displacement reaction, and eventually cause the coating to have a dotted structure.

What are the advantages of using ammonium citrate as a complexing agent in the preparation of silver-coated copper alloy powder by the replacement method?

When ammonium nitrate is used as a complexing agent, the reduction of silver is very thorough, the silver plating layer is well combined on the surface of the copper powder and is uniform and detailed

What will be the result of using sodium tartrate as a complexing agent in the preparation of it by the replacement method?

When sodium tartrate is used as a complexing agent, the silver particles are relatively evenly distributed and small and adhere to the copper powder， but the problem is the copper and silver are not closely combined. When using ultrasonic cleaning, there will be black silver particles suspended in the solution.

The influence of dispersant in the preparation of product by displacement method?

First, the dispersant can disperse the copper powder to obtain a suspension, which is beneficial to the uniform deposition of silver particles on copper powder; secondly, it can also make the replacement, and reduction of silver powder particles fine and uniform, and the proportion of coating on the surface of the copper powder is relatively high.

What are the advantages of silver-coated copper powder compared to ordinary copper powder?

The Silver Copper Alloy Powder coated with a layer of elemental silver on the surface of the copper powder by chemical coating method will change the appearance color from silver to red with the increase of silver content, which not only makes the copper powder have anti-oxidation properties but also significantly reduces the migration of silver. While having the characteristics, and advantages of simple copper and silver, it greatly reduces the cost of use and can partially or completely replace pure silver powder.

Why should the copper powder be pretreated before the silver-coated copper alloy powder is prepared by the chemical displacement method?

Because there will be a layer of oxides and organic matter attached to the surface of the copper powder on the surface of copper powder, if no pretreatment is carried out, it will hinder the progress of the chemical reaction and make the silver layer lose, which will eventually lead to the conductivity and oxidation resistance of the product. The sex is greatly reduced. Therefore, the copper powder must be pretreated before the product is prepared, so that the pure copper is exposed and fully contacted with the complexing liquid.

How to pretreat copper powder prepared by chemical replacement method for silver-coated copper powder?

The copper powder is ultrasonically cleaned in deionized water at room temperature. After three times of cleaning, the copper powder is cleaned by suction; after the copper powder is filtered, 3% dilute sulfuric acid is added for another ultrasonic cleaning. After three times of acid washing, suction is performed; finally, the copper powder is placed It is ultrasonically cleaned in deionized water, filtered after three items of washing, and then added to clean deionized water.

For the preparation the completion of the final characterization of the copper powder wallet What?

Including but not limited to performance color, particle size test, powder tap density, powder bulk density, specific surface area, high-temperature oxidation resistance, electrical conductivity.

What are the main advantages of preparing flaky silver-coated copper powder by chemical reduction?

Including but not limited to: It has low pollution, high purity, and uniform particle structure. Because the reaction conditions can be accurately controlled, therefore, we accurately control the particle size and shape of product.

What are the main disadvantages of the flaky silver copper powder prepared by chemical reduction?

Due to the low concentration of silver ions, simply increasing the concentration of silver in the reaction system will result in uncontrollable nano-silver powder morphology and particle size range, The result is a decline in the production efficiency of the product.

What are the main methods to solve the disadvantages of preparing flake silver copper powder by chemical reduction?

Including but not limited to adding more dispersant.

What are the testing and analysis methods for silver and copper powder?

Including but not limited to microscopic morphology and energy spectrometer analysis, diffraction pattern (XRD) analysis.

What are the characteristics of dendritic silver coated copper powder?

The dendritic product has excellent characteristics of good conductivity, low resistivity, high dispersion, high stability, oxidation resistance, and low cost. We, Yosoar, as a supplier of silver-plated copper powder, can effectively and stably check product quality, and can provide many differentiated products with a different silver content and no copper particle size.

What is the probably price of flake silver-coated copper powder?

As a supplier of flaky silver copper powder, our company can tailor the particle size and morphology according to your requirements. Common particle sizes are 3 um/5 um/7 um/10 um/17 um, etc., and the price per kilogram ranges from a few hundred yuan to a few thousand yuan. Our products are packed in double-layer anti-static bags or aluminum foil bags, the safety and integrity of the product can be guaranteed even during long-distance transportation.

What are the advantages of ultra-fine flake silver-coated copper powder?

The paste using ultra-fine it filler greatly improves the stability, shielding effect, and adhesion strength of the paste due to the special two-dimensional structure of the powder itself, and the printed circuit of the paste is uniform and flat.

What are the characteristics of a silver-coated copper powder suitable for FPC electromagnetic wave shielding materials?

The flexible circuit board (FPC) is a highly reliable and flexible printed circuit made of polyimide or polyester film as the base material. I.e. shielding film EMI protective film, absorbing materials, Then, by punching or pressing a cover film on the CCL, the internal functions of the line of weakness electromagnetic interference. The composite material made of this ( Silver Copper Alloy Powder) has high strength, good elasticity, good fatigue resistance, and homogeneity can be greatly improved.

What are the advantages of flaky compared to granular silver copper powder?

Including but not limited to: the highly it raise the specific surface area of the copper powder, can raise the proximity and number of particles in the material at the same time. Compared with spherical, the electrical conductivity can be greatly improved.

What are the specific applications of silver copper powder?

Including but not limited to chip multilayer ceramic capacitor electrode paste, metal powder conductive fillers for electromagnetic shielding coatings, and conductive adhesives for electronic packaging.

Is polydopamine suitable as an antioxidant for silver copper powder preparation?

In terms of oxidation resistance, polydopamine does have a certain promotion effect on the oxidation resistance of this, but due to its oxidation and adsorption characteristics, the copper exposed to the silver-clad copper powder will be oxidized. Therefore, polydopamine is not suitable for use as an antioxidant for the manufacture of silver-plated copper powder.

What effect do different glass powders have on the electrodes obtained by sintering silver-coated copper powder?

But not limited to: different glass powders have a greater impact on the surface flatness, number of holes, etching depth, and square resistance of the electrode.

What effect do different sintering temperatures have on the electrode obtained by sintering silver-coated copper powder?

Including but not limited to when the sintering temperature is too low, the glass powder cannot be completely melted, the fluidity of the paste is poor, the electrode has many holes after sintering, and the conductivity is poor. Similarly, when the temperature is too high, the copper in the paste will be oxidized by air, so that the conductivity of the electrode will decrease.

What effect does different glass powder content have on the electrode obtained by sintering silver-coated copper powder?

Including but not limited to: because the content of glass powder is gradually increasing, the electrode surface becomes smoother and smoother, the powder blends better, the holes decrease, the etching depth increases, and the electrode square resistance also decreases.

What is the difference between silver-coated copper powder paste electrode and silver powder paste electrode?

They will produce silver migration when the positive electrode and the water-electrolyte are applied, but under the same conditions, the paste has an anti-silver migration performance that is much better than that of the silver paste.

In which areas are silver-coated copper powder widely used?

Ag coated CU’s application including but not limited to conductive rubber, conductive plastic, conductive or static conductive paint, conductive glue, conductive paint, non-polar sterilization materials, high-efficiency catalysts, hidden materials.

What is the difference between silver-coated copper powder prepared with two different reducing agents: PVP and VC?

Using PVP is used as the dispersant, the temperature is. 70℃, the preparation of ultra-fine copper powder wallet out the reaction after 1h an average particle diameter uniformity is good, good sphericity. Using VC as a reducing agent, silver-coated copper powder in the above fresh after washing, 70℃ the reaction at a temperature 1h prepared completed wallet Copper is preferably coated powder morphology, compact cladding layer, but The average particle size is slightly larger than the former.

What are the parameter requirements for the preparation of silver-coated copper powder by electroless plating?

In general, use may be 20g/L, glucose. 30g/L, PH11, plating time. 40 Preparation min under conditions resulting mass fraction of silver 46 is percent wallet Copper.

In which the phenomenon will be the preparation of the wallet Copper plating method?

In the early stage of electroless plating, silver ions will be deposited as silver particles with an island-like structure. As the reaction proceeds further, due to the self-catalysis of the silver layer, many silver particles are produced, which makes the original island-like structure extend and grow, and finally form a multi-plated layer. Stacked structure.

What is the purpose of it, and what is the mainstream process for preparing silver-coated copper powder? In recent years, it has a wide range of uses, not only as electrodes for chip electronic components but also in catalysts, electronic pastes, and other fields. At present, the electronic pastes used in my country are micron-level pure silver powder, which is expensive and mainly depends on pure imports. Micron pure silver powder has the problem of particle sedimentation in the large-scale mechanized production process of electronic products. The product can effectively solve this problem and can reduce the amount of silver, and the cost of the product, which has a broad market prospect. It has many uses, but its preparation process needs to be further improved. The displacement plating process is simple, and the originality is confided, but the plating layer is more litigious, and the deposition speed is not easy to control. The electroless plating layer has a uniform thickness and low pinhole rate, but the process is relatively complicated, the stability of the plating solution is poor, and the reaction speed is too fast. By adopting the replacement and chemical deposition technology, the advantages of plating and chemical reduction plating can be placed behind the shoulder. The process is simple, the cost is lower, the deposition speed is faster, and it is easy to control, and the uniform coating thickness and the quality is good. In the foreseeable future, the replacement and compounding method will become the mainstream process for preparing it.

Dendritic silver-coated copper powder is a good highly conductive filler. What are the specific applications?

Dendritic silver-coated copper powder is a good highly conductive filler. What are its specific applications?

As an excellent highly conductive filler, the dendritic product can be made into various conductive and electromagnetic shielding products. It can be added to paint, ink, rubber, adhesive, polymer paste, and it is widely used. What are the applications? It can be widely used in industries such as conductive adhesives, coatings, polymer pastes, various microelectronic materials, and surface metallization treatment of non-conductive materials. It is a new type of conductive composite powder. The application fields of dendritic is used of conductive and electromagnetic shielding films in various industries such as electronics, electronics, communications, printing, aerospace, and completion. Like mobile phones, computers, integrated circuits, various electrical appliances, electronic medical equipment, electronic instruments, etc., so that products are not interfered with by electromagnetic waves while reducing the harm caused by electromagnetic radiation to the human body, as well as the conductivity of colloids, circuit boards, and other insulators. Treatment to make the insulated object have good electrical conductivity. Our company is strong and is a high-tech enterprise specializing in R&D, production, and sales of dendritic, spherical, and flake . The product application is aimed at the 5G electronic product market.The latest price of the product: How much is the dendritic about a kilogram?

What is the analysis about the advantages and disadvantages of dendritic silver-coated copper powder?

The advantages of dendritic are low resistivity, good conductivity, high dispersion, and high stability, which solves the high cost of pure silver and the oxidation resistance of copper powder while ensuring a good product Conductivity, it is the ideal conductive powder at present. Cost issues, while ensuring the good conductivity of the product, is an ideal conductive powder. We, Yosoar, as a supplier of silver-plated copper powder, have mature production and technical processes, which can effectively check the stability of batches, and can provide it with different silver content in spherical, flake, and dendritic shapes. According to the different fields of use.

An objective analysis of silver-coated copper powder manufacturers: the advantages, and disadvantages of flake silver powder prepared by chemical reduction method.

The chemical reduction method is usually a method of preparing silver powder by decreasing silver compounds with a reducing agent under liquid, solid, or gas phase conditions. The chemical preparation of flaky involves chemical reduction and precipitation processes, including reduction of silver ions, supersaturation, nucleation, silver crystal formation, silver core growth, and agglomeration.

The PVP was metered into the diluted solution of silver nitrate and then added dropwise to the reaction terminating buffer solution to prepare a particle size of 0.4 μm silver flake, the yield of up to 9.9 %. The ferrous sulfate-containing solution was poured into a citric acid solution of silver nitrate was prepared to have a particle size 2 ~ 10 μm, irregularly shaped silver flake, and found to have a greater impact on various products of silver nitrate was added embodiment.

Glucose as the reducing agent, polyvinyl pyrrolidone (of PVP) dispersing agent and as a protective agent, silver nitrate source is silver, the reaction temperature constant at 4.8h, regular morphology obtained after centrifugation of triangular silver micrometric sheet, a side is 800 nm ~ 1 μm, with a thickness of 30 nm and the like, only PVP as a reducing agent and a surfactant. 60℃reaction 2.1H, successfully prepared in a particle sizes distribution 0.3 UM ultrafine hexagonal and triangular silver flake And the diameter of the flake silver powder can be adjusted by the length of the reaction time.

Produced by chemical reduction of silver flake main advantages are: chemical flake silver powder prepared by mechanical milling will not yield further pollution, high purity, uniform structure example, and this can be made more precise control of the reaction conditions conducive to give Silver flakes with controllable particle size and shape. The main disadvantages of the flaky prepared by chemical reduction method are: low silver ion concentration, high cost, and low yield, which cannot meet the large demand for flaky , and increase the concentration of silver particles in the reaction system It will cause problems such as uncontrollable morphology of nanosilver powder and wide range of particle size distribution.

At the same time,The physical properties of the powder are not good, and the zero potential resistance increases when used in the paste. To solve the disadvantages of the flake silver-coated copper powder produced by the flake reduction method, the main disadvantages are: To ensure better dispersibility, the product prepared by the chemical reduction method generally needs to add more dispersants (protective agents).

It is difficult to remove all of them during washing, and some even contain sulfur. Under certain temperature and humidity conditions, the granulated Ag in the conductive electrode material chemically reacts with the sulfur in the environment to produce black, which will increase the vulcanization of the product and increase the square resistance.

The grain size of the conductive silver-coated copper powder has impact on the paste.what is the details?

The surface effect and small size effect of the nanoparticles make the paste have a lower sintering temperature. The high surface of the small particle size can promote the shrinkage of pores, and the annihilation of vacancies, which can effectively improve the connection strength and reduce the resistivity.

If the nanoparticles are uniformly dispersed, the shear strength and joint strength can be improved. Therefore, the silver-coated copper powder uses nano-fillers as electrical conductivity. The fillers can effectively reduce the seepage threshold and sintering curing temperature, and improve the electrical and thermal properties, and improve the paste shear Strength, etc. However, the silver-coated copper powder nanoparticles are easy to form agglomerations before the paste is sintered, which makes the paste difficult to sinter, easy to form dispersed lumps, and it is difficult to increase the silver content of the silver paste.

When the metal particles are reduced in size (submicron diameter D <. 1 UM) when the electrical conductivity drastically decreases when the particle size is reduced to the nanoscale, the electrical conductivity is drastically reduced, and the silver nano less sediment precipitation and collection. However, when the thickness of the sub-micron flake ultrafine silver powder reaches the nanometer level, it has the dual advantages of micron and nanopowder.

After the conductive coating is cured, the particle size and square resistance directly show a gradual decrease trend. Therefore, the paste using ultra-fine flake filler has good paste stability, shielding effect, and adhesion strength due to the special two-dimensional structure of the powder.

The conductive silver paste prepared by the ultra-fine flake silver powder with a concentrated particle size distribution, the printed circuit board is uniform and flat, and the size and surface characteristics have various effects. The ultra-fine flake silver powder used in the conductive phase has a decisive effect on the performance of the paste. So far, silver-coated copper powder-filled conductive paste has achieved many results, but there are still many issues to be discussed, such as the influence of silver powder morphology, filling, dispersion, and surface treatment on electrical and mechanical properties.

With the development trend of miniaturization and integration of large-scale integrated circuits and the development of micro-nano technology, a solid foundation has been laid for the wide application of micro-nano silver-filled conductive pastes. The superfine prepared by different methods has its advantages and disadvantages. Researchers need to make up for their shortcomings, and many researchers should pay great attention and attention to it. In this way, it will promote a whole new generation of electronic pastes. The development of a process, technology, materials, and equipment are of great significance.