Copper Vein Powder Coat

Bulk specific weight: 3-3.5g/cm3
Chemical Composition ( %): Cu≥99.5%
Density(g/mL,25℃).: 8.92g/cm3
Solubility: Insoluble

Product Description:

Product name: Copper powder

Keyword: Copper vein powder coat

Bulk specific weight: 3-3.5g/cm3

Chemical Composition ( %): Cu≥99.5%

Density(g/mL,25℃).: 8.92g/cm3

Solubility: Insoluble

Copper Vein Powder Coat

Product Parameter 

Copper Vein Powder Coat

Copper Vein Powder Coat Copper Vein Powder Coat Copper Vein Powder Coat Copper Vein Powder Coat

Application:

Copper Vein Powder Coat

Application direction of Nano copper powder:

As the production, microelectronic device used in the manufacture of multi-layer ceramics capacitor terminals, Can be used for carbon dioxide and hydrogen synthesis catalyst reaction process such as methanol, Metallic and nonmetallic surface coating processing; conducting Conductive pulp, used as lubricant and pharmaceutical industries oil.

Factory Photo:

Copper Vein Powder Coat Copper Vein Powder Coat

Preparation method of chemical reduction method of nano copper powder:

The chemical reduction method is currently the most commonly used preparation method for preparing nanometers in the laboratory and industry.

The method comprises the steps of: selecting a suitable soluble copper salt precursor and reacting with a suitable reducing agent such as N2H4H2O, NaBH4 ascorbic acid in a liquid phase, Cu2+ reduction, and nucleation growth to a Nano copper powder. In the process of preparing metal nanoparticles by chemical reduction, Nano-copper is easy to oxidize or agglomerate, which limits its practical application. Surface modification technology provides a practical way for surface modification of nanoparticles. Through the modification of the surface of the nanoparticles, the dispersion stability of the nanoparticles can be improved, and at the same time, new physical and chemical properties can be generated on the surface of the particles, and the compatibility between the nanoparticles and other substances can be improved, thereby effectively solving the agglomeration of the nanoparticles. Oxidation inactivation and other issues. Common molecular ligands for the preparation of copper nanomaterials by chemical reduction include surfactants, various polymers and dendrimers, thiols and their derivatives.

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Copper Vein Powder Coat

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